Void Reduction in Solder Joint for Power Module
نویسندگان
چکیده
منابع مشابه
Avoiding the Solder Void
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper “san...
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ژورنال
عنوان ژورنال: Journal of The Japan Institute of Electronics Packaging
سال: 2012
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.15.470